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TSSOP Datasheet, STATS ChipPAC

TSSOP Datasheet, STATS ChipPAC

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TSSOP packages equivalent

  • small outline packages.

TSSOP Features and benefits

TSSOP Features and benefits

TSSOP
* Body Size: 3.0 x 4.4mm to 14.0 x 6.1mm
* Lead Count: 8L to 56L
* Lead Pitch: 0.50mm & 0.65mm
* Package Height: 1.20mm max.
* JEDEC standard co.

TSSOP Application

TSSOP Application

requiring a thin profile. TSSOP is a leadframe based, plastic encapsulated package with gull wing shaped leads on two si.

TSSOP Description

TSSOP Description

STATS ChipPAC offers a complete line of Small Outline Package (SOP) families including TSSOP, TSSOP-ep, and MSOP. STATS ChipPAC’s TSSOP (Thin Shrink Small Outline Package) is suitable for applications requiring a thin profile. TSSOP is a leadframe ba.

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TAGS

TSSOP
Small
Outline
Packages
STATS ChipPAC

Manufacturer


STATS ChipPAC

Related datasheet

TSSOP-16

TSSOP-20

TSSOP-8

TSSOP-B14J

TSSOP-B8

TSSOP-B8J

TSSOP-C10J

TSSOP-C48V

TSSOP14

TSSOP20

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